Sr Engineer, Package Pre Stacking

Micron Technology

Taichung, Taiwan
Hybrid
More than 3 years package process experience
Experience with wafer dicing techniques
Familiar with assembly and packaging processes
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • The role involves advanced package technology research and development for HBM products.
  • Candidates will engage in process development and work with external suppliers to support new assembly processes.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • More than 3 years package process experience
  • Experience with wafer dicing techniques
  • Familiar with assembly and packaging processes

Nice-to-have

  • Familiarity with SPC and JMP data analysis
  • Experience with problem-solving techniques
  • Ability to work with external suppliers

Key Requirements

  • Understanding of advanced package technology such as HBM/3Di
  • Experience with dicing tool operation
  • Dicing tape evaluation experience

Work Rights

Not specified

Tailored Resume

Cover Letter