3d-ic Methodology Architect

GlobalFoundries

3d-ic methodology design and verification
Emag thermal and package flows expertise
Heterogeneous integration flow development
This role involves developing design and verification methodologies for 3D-IC systems with a focus on EMAG, thermal, and package flows

Job Summary

  • This role involves developing design and verification methodologies for 3D-IC systems with a focus on EMAG, thermal, and package flows.
  • The successful candidate will lead technical teams, drive standards across the organization, and collaborate with EDA vendors and internal partners.
  • Candidates must have over 15 years of industry experience including more than 10 years in relevant design or design enablement of IPs.

Matching Summary

This role involves developing design and verification methodologies for 3D-IC systems with a focus on EMAG, thermal, and package flows.

Skills & Requirements

Must-have

  • 3D-IC methodology design and verification
  • EMAG thermal and package flows expertise
  • Heterogeneous integration flow development
  • EDA tools and PDK knowledge
  • RF AMS silicon photonics packaging design
  • Unix environment proficiency

Nice-to-have

  • Java coding experience
  • Generative AI interest or coursework
  • Project management skills
  • Cross-functional team collaboration
  • Version control and configuration management

Key Requirements

  • Bachelor of Engineering or equivalent degree
  • Minimum 15 years of relevant industry experience
  • Over 10 years in design or design enablement of IPs
  • Fluent English language skills
  • Proficient Unix environment knowledge

Work Rights

Not specified

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