Silicon Photonics Module Packaging Integration Engineer (2026 New College Graduate)

GlobalFoundries

Base: $65,400.00 - $145,800.00; bonus/equity: not ...
Hybrid
Photonix platform
2.5d and 3d co-packaged optics
Siph flip chip assembly
This hands-on packaging assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements

Job Summary

  • This hands-on packaging assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements.
  • The candidate will bring a strong focus on tool process interactions for each assembly step in a SiPh Flip Chip assembly.
  • GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.

Matching Summary

This hands-on packaging assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements.

Salary

Base: $65,400.00 - $145,800.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Photonix platform
  • 2.5D and 3D co-packaged optics
  • SiPh Flip Chip assembly
  • optical fiber attach
  • 3D electrical interconnect solutions

Nice-to-have

  • materials science expertise
  • thermal and mechanical simulation
  • global technology trends awareness
  • project management skills
  • cross-functional collaboration

Key Requirements

  • Master's or PhD in Electrical Engineering
  • Internship or research experience in Photonics and Optical assembly
  • 3.0 GPA overall
  • English fluency

Work Rights

Not specified

Tailored Resume

Cover Letter