Smts Photonics Advanced Packaging Integration

GlobalFoundries

Base: $107,400.00 - $204,500.00; bonus/equity: not...
Hybrid
Silicon photonics packaging development
Fiber-to-chip coupling strategies
Heterogeneous integration technologies
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms

Job Summary

  • Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.
  • Collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures.
  • Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

Matching Summary

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Salary

Base: $107,400.00 - $204,500.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Silicon photonics packaging development
  • Fiber-to-chip coupling strategies
  • Heterogeneous integration technologies
  • Multiphysics simulations
  • Root cause analysis for yield issues
  • Mass production readiness
  • Optical packaging architectures

Nice-to-have

  • Automated optical test setups
  • Co-packaged optics knowledge
  • Thermal/mechanical modeling expertise
  • Cross-functional team leadership

Key Requirements

  • Master's degree or higher
  • 5+ years semiconductor packaging experience
  • Hands-on fiber attach experience
  • Experience bringing products to production
  • Strong written and spoken English

Work Rights

Not specified

Tailored Resume

Cover Letter