Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel Corporation

Phoenix, Arizona, US
Base: $220,320.00-311,040.00 usd; bonus/equity: st...
10+ years industry experience
5+ years in semiconductor packaging
Bachelor's or master's degree in engineering
This role is pivotal in enabling foundry customers by providing technical consultation on cutting-edge Advanced Packaging capabilities

Job Summary

  • This role is pivotal in enabling foundry customers by providing technical consultation on cutting-edge Advanced Packaging capabilities.
  • The engineer will own the end-to-end customer relationship, ensuring seamless communication and alignment across all phases of engagement.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, retirement plans, and vacation time.

Matching Summary

This role is pivotal in enabling foundry customers by providing technical consultation on cutting-edge Advanced Packaging capabilities.

Salary

Base: $220,320.00-311,040.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging
  • Bachelor's or Master's Degree in Engineering

Nice-to-have

  • Strong communication skills
  • Project management expertise
  • Willingness to travel

Key Requirements

  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging or Backend Manufacturing
  • Degree in Electrical, Materials, Mechanical, or Chemical Engineering

Work Rights

Not specified

Tailored Resume

Cover Letter