Job Summary

• The Bonding Application Manager plays a critical role in advancing Applied Materials’ hybrid bonding technology by leading application development, driving customer engagement, and ensuring seamless integration of bonding solutions into advanced semiconductor manufacturing workflows.
• This role requires a strong technical foundation, customer‑facing experience, and the ability to lead a high‑performing engineering team to deliver innovative solutions that align with strategic business and technology roadmaps.
• You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.

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Skills & Requirements

Key Requirements

• Master’s/PhD preferred
• Semiconductor process engineering experience
• Hybrid bonding experience
• Advanced packaging experience
• Proven ability to lead engineering teams

Work Rights