Member of Technical Staff, Advanced Packaging Technology Development – Process Integration
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Singapore
Not specified
25+ years semiconductor advanced packaging experience
Phd or master's in electrical engineering
Expertise in tsvs, tcb, w2w, c2w stacking technologies
Micron Semiconductor Asia Operations is seeking a Member of Technical Staff for Advanced Packaging Technology Development focused on process integration. The ideal candidate will lead package health monitoring initiatives and drive innovation in advanced packaging technologies, requiring extensive experience in semiconductor packaging and leadership in cross-functional environments
Job Summary
The role leads the strategic direction for package health monitoring initiatives across advanced packaging technologies.
Responsibilities include developing next-generation interconnects for memory and logic technology while overseeing AI-driven predictive health analytics.
The position requires establishing cross-functional governance for Design for Test (DFT) and representing strategy in executive forums.
Matching Summary
Match Score: 85
Micron Semiconductor Asia Operations is seeking a Member of Technical Staff for Advanced Packaging Technology Development focused on process integration. The ideal candidate will lead package health monitoring initiatives and drive innovation in advanced packaging technologies, requiring extensive experience in semiconductor packaging and leadership in cross-functional environments.
Skills & Requirements
Must-have
25+ years semiconductor advanced packaging experience
PhD or Master's in Electrical Engineering
Expertise in TSVs, TCB, W2W, C2W stacking technologies
Leadership in cross-functional global engineering environments
Experience with AI/ML predictive health analytics
Nice-to-have
Publications or patents in packaging reliability
Track record of defining DFT strategies
Experience with heterogeneous integration flows
Strong background in simulation and modeling
Mentoring technical leaders across organizations
Key Requirements
25+ years of experience in semiconductor advanced packaging
Ph.D. or Master's degree in Electrical Engineering or Materials Science
Proven leadership in global engineering environments
Record of technology innovation via patents or publications