Wafer Backside Processing Technician

FLIR

$50,600.00-$67,500.00 py
Hybrid
Cleanroom operations
Die preparation
Hybridization
FLIR is seeking a Wafer Backside Processing Technician to perform various technical tasks related to backside wafer processing and assembly operations in a cleanroom environment. The ideal candidate should have 1-2 years of experience in semiconductor assembly or wafer processing and be able to work the second shift from 2:30 pm to 11:00 pm

Job Summary

  • Performs a variety of technical tasks associated with backside wafer processing and assembly operations in a cleanroom environment.
  • This role supports production and engineering priorities, focusing on die preparation, hybridization, wicking, and wire bonding processes.
  • Competitive Salary & Benefits Package including Health, Dental, Vision, and Life Insurance from Day 1, Paid Vacation, Sick Time, and Holidays, and 401(k) with Company Match.

Matching Summary

Match Score: 85

FLIR is seeking a Wafer Backside Processing Technician to perform various technical tasks related to backside wafer processing and assembly operations in a cleanroom environment. The ideal candidate should have 1-2 years of experience in semiconductor assembly or wafer processing and be able to work the second shift from 2:30 pm to 11:00 pm.

Salary

$50,600.00-$67,500.00

Skills & Requirements

Must-have

  • Cleanroom operations
  • Die preparation
  • Hybridization
  • Wicking and underfill
  • Wire bonding
  • Metrology tools

Nice-to-have

  • Thrive on making an impact
  • Excitement of being on a team that wins
  • Ethical standards

Key Requirements

  • High School Diploma or equivalent
  • 1-2 years of experience
  • Familiarity with cleanroom operations
  • Chemical handling
  • Ability to read and follow travelers
  • Strong attention to detail
  • Teamwork skills

Work Rights

Must be eligible for export control license

Tailored Resume

Cover Letter