Engineer, Process (Die Prep)

SILICON BOX PTE. LTD.

Pasir Ris, Singapore
Not specified
Minimum 3 years die prep experience
Hands-on backgrind dicing laser grooving
Spc doe fmea and 8d report expertise
SILICON BOX PTE. LTD. is seeking a Process Engineer focused on Die Prep to develop and establish production processes within the semiconductor manufacturing sector. The ideal candidate should possess a relevant engineering degree and have at least three years of hands-on experience in die prep processes

Job Summary

  • The Process Engineer is responsible for developing and establishing production processes for Die Prep operations within the semiconductor industry.
  • Key duties include troubleshooting process issues, improving yield and cycle time from NPI to HVM stages, and leading SPC control initiatives.
  • The role requires managing customer audits, generating 8D reports, and coordinating with vendors on quality and process issues.

Matching Summary

Match Score: 85

SILICON BOX PTE. LTD. is seeking a Process Engineer focused on Die Prep to develop and establish production processes within the semiconductor manufacturing sector. The ideal candidate should possess a relevant engineering degree and have at least three years of hands-on experience in die prep processes.

Skills & Requirements

Must-have

  • Minimum 3 years Die Prep experience
  • Hands-on Backgrind Dicing Laser Grooving
  • SPC DOE FMEA and 8D report expertise
  • Cleanroom environment work experience
  • Customer NPI to HVM process support

Nice-to-have

  • Vendor and supplier coordination skills
  • Cross-functional team leadership
  • Machine buyoff and pilot line setup
  • New material and process qualification

Key Requirements

  • Minimum Degree in Electrical Electronics or Mechanical Engineering
  • Minimum 3 years hands-on Die Prep process experience
  • Experience in Semiconductor manufacturing cleanroom environment

Work Rights

Not specified

Tailored Resume

Cover Letter