Teledyne e2v Semiconductors is seeking a Package Design Engineer to lead the design flow of advanced microelectronic packages at their locations in Saint-Egrève, France, or Seville, Spain. The ideal candidate will have a background in microelectronics or related fields, along with experience in packaging design and a strong focus on customer satisfaction and innovation
Job Summary
The role involves leading the full design flow of organic and ceramic multi-layer microelectronics packaging from customer needs to final validation.
Candidates will act as the key technical interface with packaging vendors and assembly houses while conducting necessary electrical, thermal, and mechanical simulations.
Teledyne e2v offers a structured onboarding program with a dedicated mentor and opportunities for international exposure within the Teledyne group.
Matching Summary
Match Score: 85
Teledyne e2v Semiconductors is seeking a Package Design Engineer to lead the design flow of advanced microelectronic packages at their locations in Saint-Egrève, France, or Seville, Spain. The ideal candidate will have a background in microelectronics or related fields, along with experience in packaging design and a strong focus on customer satisfaction and innovation.
Skills & Requirements
Must-have
Package design flow management
Organic and ceramic multi-layer packaging
Cadence APD layout mastery
Vendor and assembly house technical interface
Electrical thermal mechanical simulations
Nice-to-have
Experience in imaging and assembly
Solidworks basic mechanical design
Ansys workbench thermal simulation
Parasitic extraction knowledge
System and sub-system development experience
Key Requirements
Master's degree in microelectronics or related field