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NXP USA INC. is seeking an Equipment Engineer for their Kuala Lumpur facility, focusing on enhancing packing quality and coordinating packing material processes in semiconductor manufacturing. The ideal candidate should possess an engineering degree, relevant industry experience, and strong multitasking abilities in a fast-paced environment.
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Job Summary
Accountable to drive total ATKL packing cost implementation, packing material standardization and packing quality across.
Work collaboratively with equipment, manufacturing & supplier to improve packing quality related.
Lead or need to update SOP, SWE, OCAP, FMEA, Control plan related to packing process.
Matching Summary
Match Score: 75
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NXP USA INC. is seeking an Equipment Engineer for their Kuala Lumpur facility, focusing on enhancing packing quality and coordinating packing material processes in semiconductor manufacturing. The ideal candidate should possess an engineering degree, relevant industry experience, and strong multitasking abilities in a fast-paced environment.
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Skills & Requirements
Must-have
Drive packing cost implementation
Packing material standardization
Improve packing quality
Lead TBE NPI for packing
Update packing process documentation
Packing qualification
Update packing method in APL
Nice-to-have
Work in fast-paced environment
Open-minded and positive attitude
Motivated team player
High level of ownership
Knowledge in programming language
Key Requirements
Engineering Degree (Electronics or Mechanical or Mechatronics or Chemical)