Capillary Underfill Technology Development Module Engineer
Intel Corporation
Kulim, Malaysia
Onsite
Develops assembly processes and equipment
Optimizes manufacturing efficiency
Develops process and equipment specifications
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies
Job Summary
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
Matching Summary
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Skills & Requirements
Must-have
Develops assembly processes and equipment
Optimizes manufacturing efficiency
Develops process and equipment specifications
Develops new techniques and acceleration methods
Leads innovation and problem solving
Nice-to-have
Data science/statistical tools experience
AI/ML knowledge is a plus
Key Requirements
Bachelor’s or Master’s degree
Research and development in assembly and packaging