Ic Package Design / Development

Broadcom

Multiple Locations
Base: $108,000 - $192,000; bonus/equity: discretio...
Advanced ic packaging for 7nm and below
Substrate design and floor-planning
Signal integrity and power integrity optimization
We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and productization using advanced node silicon (7nm, 5nm, 3nm and beyond)

Job Summary

  • We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and productization using advanced node silicon (7nm, 5nm, 3nm and beyond).
  • This role partners closely with chip design, system design, SI/PI, thermal, and manufacturing teams to define and deliver industry-leading package solutions.
  • Broadcom offers a competitive and comprehensive benefits package including medical, dental, vision, 401(K) with matching, ESPP, paid holidays, sick leave, and vacation time.

Matching Summary

We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and productization using advanced node silicon (7nm, 5nm, 3nm and beyond).

Salary

Base: $108,000 - $192,000; Bonus/Equity: Discretionary annual bonus and equity awards; Benefits: Medical, dental, vision, 401(K) matching, ESPP, paid leave

Skills & Requirements

Must-have

  • Advanced IC packaging for 7nm and below
  • Substrate design and floor-planning
  • Signal integrity and power integrity optimization
  • Cadence Allegro APD or equivalent tools
  • High-volume manufacturing qualification
  • Cross-functional project leadership

Nice-to-have

  • Experience with global OSATs and substrate suppliers
  • Strong communication and customer-facing skills
  • Thermal management expertise
  • High layer count flip chip BGA technology knowledge

Key Requirements

  • BS with 8+ years or MS with 6+ years or PhD with 3+ years experience
  • Degree in Electrical, Mechanical Engineering or Materials Science
  • Proven ability to drive NPI through HVM
  • Experience with advanced silicon nodes packaging
  • Must have relevant work authorization

Work Rights

Not specified

Tailored Resume

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