Advanced Packaging Module Development Engineer

Intel Corporation

Phoenix, Arizona, United States
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Hybrid
Process development and optimization
Equipment capability assessment
Statistical methodologies and doe
Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment

Job Summary

  • Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment.
  • Apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability aligned with Intel’s advanced packaging roadmap.
  • Collaborate with cross-functional teams to solve complex technical challenges, introduce innovative process improvements, and ensure Intel remains a technology leader in advanced packaging.

Matching Summary

Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Process development and optimization
  • Equipment capability assessment
  • Statistical methodologies and DoE
  • Panel level processes development
  • Process characterization and control

Nice-to-have

  • Data-driven problem solving
  • Cross-functional collaboration
  • Continuous learning and improvement
  • Adaptable to fast-paced environments

Key Requirements

  • Bachelor's degree in relevant engineering/science field
  • 4+ years of experience in process development
  • Experience with DoE and statistical data analysis
  • Experience with process characterization and SPC
  • Experience with materials testing and characterization techniques

Work Rights

Not specified

Tailored Resume

Cover Letter