Principal Product Development Engineer

Raytheon

REMOTE, US
Base: 107,500 usd - 204,500 usd; bonus/equity: not...
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Printed circuit board manufacturing
Circuit card assembly lifecycle
Ipc and mil specifications
** Raytheon is seeking a Principal Product Development Engineer for a remote position focusing on Printed Circuit Board (PCB) and Circuit Card Assembly (CCA) processes. The ideal candidate will have at least 8 years of experience in engineering with a strong background in manufacturability, IPC specifications, and technical problem-solving. **

Job Summary

  • As a Product Development Engineer (PDE), you will serve as the Subject Matter Expert in manufacturability for several programs, with a specific focus on the Printed Circuit Board and Circuit Card Assembly product lifecycle.
  • You will work closely with suppliers to address challenges and resolve technical issues, gathering and applying lessons learned from suppliers to drive continuous improvement by incorporating supplier feedback into redesigns.
  • The salary range for this role is 107,500 USD - 204,500 USD, and hired applicants may be eligible for benefits including medical, dental, vision, 401(k) match, and more.

Matching Summary

Match Score: 75

** Raytheon is seeking a Principal Product Development Engineer for a remote position focusing on Printed Circuit Board (PCB) and Circuit Card Assembly (CCA) processes. The ideal candidate will have at least 8 years of experience in engineering with a strong background in manufacturability, IPC specifications, and technical problem-solving. **

Salary

Base: 107,500 USD - 204,500 USD; Bonus/Equity: Not specified; Benefits: Medical, dental, vision, 401(k) match, etc.

Skills & Requirements

Must-have

  • Printed Circuit Board manufacturing
  • Circuit Card Assembly lifecycle
  • IPC and MIL specifications
  • supplier support and collaboration
  • design reviews and collaboration

Nice-to-have

  • continuous improvement initiatives
  • innovative solutions development
  • cross-functional team leadership
  • organizational objectives alignment

Key Requirements

  • Bachelor’s Degree in Engineering
  • 8 years of related experience
  • PCB manufacturing experience
  • Circuit card assembly experience
  • IPC and MIL specifications understanding
  • Ability to obtain US security clearance
  • US Citizenship required

Work Rights

U.S. government issued security clearance required

Tailored Resume

Cover Letter