Packaging Engineer, Annapurna Labs

Amazon

Taipei, Taiwan
On-site
Ip integration experience
2.5d packaging design knowledge
Substrate and package bom definition
Join a dynamic team to design and implement next-generation machine learning chips and servers at Annapurna Labs

Job Summary

  • Join a dynamic team to design and implement next-generation machine learning chips and servers at Annapurna Labs.
  • Take full ownership of mechanical and thermal performance while optimizing tradeoffs with the hardware development team.
  • Collaborate with architects, design teams, and OSAT vendors to define substrate BOMs and improve assembly yields.

Matching Summary

Join a dynamic team to design and implement next-generation machine learning chips and servers at Annapurna Labs.

Skills & Requirements

Must-have

  • IP integration experience
  • 2.5D packaging design knowledge
  • substrate and package BOM definition
  • mechanical and thermal performance ownership
  • OSAT vendor collaboration

Nice-to-have

  • machine learning chip domain knowledge
  • future technology roadmap exploration
  • cross-functional team leadership
  • yield improvement initiatives

Key Requirements

  • Experience in packaging and assembly technology roadmaps
  • Expertise in IC testability and validation workflows
  • Ability to work with Fab/assembly/test interfaces

Work Rights

Not specified

Tailored Resume

Cover Letter