Principal Solutions Engineer: Allegro Package Designer

Cadence Design Systems Inc.

Belo Horizonte, Minas Gerais, Brazil
Not specified; not specified; competitive benefits
Not specified (assumed to be in-office based on location).
Bachelor's degree in electrical or electronics engineering
Experience with package design and apd
Strong knowledge of advanced packaging concepts
Cadence Design Systems Inc. is seeking a Principal Solutions Engineer for their Allegro Package Designer team in Belo Horizonte, Brazil. The ideal candidate will have experience in advanced packaging design, particularly with Cadence Allegro Package Designer, and will be responsible for delivering innovative packaging solutions

Job Summary

  • The role involves delivering advanced packaging and 3DIC implementation flows for foundry and customer solutions primarily using Cadence Allegro Package Designer.
  • Cadence has been nominated as a Great Place to Work globally and in Brazil and is also a Fortune 100 Best Companies to Work For.
  • This position requires creating and implementing 3DIC reference flows while handling bond wires, bumps, and 3D structures.

Matching Summary

Match Score: 85

Cadence Design Systems Inc. is seeking a Principal Solutions Engineer for their Allegro Package Designer team in Belo Horizonte, Brazil. The ideal candidate will have experience in advanced packaging design, particularly with Cadence Allegro Package Designer, and will be responsible for delivering innovative packaging solutions.

Salary

Not specified; Not specified; Competitive benefits

Skills & Requirements

Must-have

  • Bachelor's degree in Electrical or Electronics Engineering
  • Experience with package design and APD
  • Strong knowledge of advanced packaging concepts
  • Expertise with GDS, Gerber, IPC, and DXF formats
  • Creating Virtuoso-ready APD package files

Nice-to-have

  • Strong programming knowledge with Allegro Skill and Ravel
  • Customer-facing communication and problem-solving skills
  • Personal drive for continuous learning

Key Requirements

  • Complete Bachelor's degree in Electrical or Electronics Engineering
  • Experience with package design and APD
  • Strong knowledge of 2.5D, 3DIC and stacked die technologies

Work Rights

Not specified

Tailored Resume

Cover Letter