Director, Heterogenous Integration/advance Packaging

Applied Materials Inc

Albany, NY, US
Base: $180,000.00 - $247,500.00; bonus/equity: eli...
Hybrid
Ms/phd in electrical or material engineering
10+ years experience in advanced packaging
Expertise in w2w/d2w bonding and tsv
The successful candidate will lead the development of new modules in Advanced Semiconductor Packaging as part of a global diverse cross functional team

Job Summary

  • The successful candidate will lead the development of new modules in Advanced Semiconductor Packaging as part of a global diverse cross functional team.
  • This role requires deep domain expertise in areas such as micro bumps, thermal management, optics, and multi-wafer stacking to enable next generation technology.
  • Applied Materials offers a supportive work culture with comprehensive benefits including bonus and stock award programs for eligible employees.

Matching Summary

The successful candidate will lead the development of new modules in Advanced Semiconductor Packaging as part of a global diverse cross functional team.

Salary

Base: $180,000.00 - $247,500.00; Bonus/Equity: Eligible for bonus and stock award; Benefits: Comprehensive health and wellbeing programs

Skills & Requirements

Must-have

  • MS/PhD in Electrical or Material Engineering
  • 10+ years experience in advanced packaging
  • Expertise in W2W/D2W bonding and TSV
  • Deep understanding of materials and process physics
  • Proven track record solving complex integration problems

Nice-to-have

  • PMP certification for program management
  • Strong communication with cross-functional teams
  • Experience managing customer technical engagements
  • Ability to drive innovation in logic DRAM NAND
  • Self-starter able to work independently

Key Requirements

  • Minimum MS/PhD degree required
  • 10+ years of specialized experience
  • Program management (PMP) certification is a plus

Work Rights

Not specified

Tailored Resume

Cover Letter