Internship: Electro/thermo Migration Reliability Capabilities Of Ic Packages
NXP
Nijmegen, Netherlands
Testing ic package reliability
Thermo-migration and electro-migration
High temperature and current exposure
This internship offers a great opportunity to develop technical, soft, and communication skills while working on real assignments contributing to NXP’s objectives
Job Summary
This internship offers a great opportunity to develop technical, soft, and communication skills while working on real assignments contributing to NXP’s objectives.
The role is within the Corporate Quality, NTI/NPI, & Reliability (CQNR) team, which supports and drives quality and reliability capabilities for NXP’s business success.
Life at NXP includes social activities, a young professional community, and opportunities to engage in volunteering and diversity initiatives.
Matching Summary
This internship offers a great opportunity to develop technical, soft, and communication skills while working on real assignments contributing to NXP’s objectives.
Skills & Requirements
Must-have
Testing IC package reliability
Thermo-migration and electro-migration
High temperature and current exposure
Collaboration in multidisciplinary teams
Fluent English communication
Nice-to-have
Experience in multinational environment
Soft skills development
Flexible and multi-tasking
International teamwork
Communication skills enhancement
Key Requirements
Master of Science in Microelectronics
Registered student status during internship
Excellent verbal and written English skills
Internship duration of 6 months or longer
Affinity with semiconductor, reliability, and physics
Work Rights
Must be registered student during entire internship