Senior Technical Solutions Engineer - Advanced Packaging

Intel Foundry

Phoenix, Arizona, United States
Base: $160,980.00-311,040.00 usd; bonus/equity: st...
Hybrid
5+ years semiconductor experience
Bachelor's degree in engineering
Advanced packaging technical expertise
This role serves as the primary customer interface and voice of the customer within Intel Foundry to drive adoption of advanced packaging technologies

Job Summary

  • This role serves as the primary customer interface and voice of the customer within Intel Foundry to drive adoption of advanced packaging technologies.
  • The position requires managing the complete customer engagement lifecycle from design award through high-volume manufacturing while resolving qualification issues.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs for this hybrid role.

Matching Summary

This role serves as the primary customer interface and voice of the customer within Intel Foundry to drive adoption of advanced packaging technologies.

Salary

Base: $160,980.00-311,040.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • 5+ years semiconductor experience
  • Bachelor's degree in Engineering
  • Advanced Packaging technical expertise
  • Customer relationship management skills
  • Cross-functional collaboration abilities

Nice-to-have

  • Post graduate degree in Engineering
  • Experience with 2.5D/3D packaging
  • Project management certification
  • Flexibility for travel as needed
  • Strong analytical thinking capabilities

Key Requirements

  • Bachelor's degree in Electrical or related Engineering field
  • 5+ years experience in Semiconductor Packaging or Assembly/Test
  • Not eligible for Intel immigration sponsorship

Work Rights

Not specified

Tailored Resume

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