Sr. Packaging Engineer-silicon Photonics Optical Engines

Analog Devices

Not specified; not specified; not specified
Silicon photonics optical engine packaging
Photonic integrated circuits pic integration
Electronic ic eic integration
This role focuses on enabling high-performance, reliable, and manufacturable integration of photonic integrated circuits with electronic ICs

Job Summary

  • This role focuses on enabling high-performance, reliable, and manufacturable integration of photonic integrated circuits with electronic ICs.
  • The engineer will work across optical, electrical, mechanical, and manufacturing disciplines to bring concepts from early development through qualification.
  • Analog Devices is a global semiconductor leader bridging physical and digital worlds to enable breakthroughs at the Intelligent Edge.

Matching Summary

This role focuses on enabling high-performance, reliable, and manufacturable integration of photonic integrated circuits with electronic ICs.

Salary

Not specified; Not specified; Not specified

Skills & Requirements

Must-have

  • Silicon photonics optical engine packaging
  • Photonic integrated circuits PIC integration
  • Electronic IC EIC integration
  • Advanced package architectures
  • Cross-disciplinary engineering collaboration

Nice-to-have

  • Supplier partnership management
  • Early development to production experience
  • Qualification process expertise

Key Requirements

  • Senior level experience in packaging engineering
  • US citizenship or permanent resident status required for export control compliance

Work Rights

Must have US citizenship or US Permanent Resident status

Tailored Resume

Cover Letter