The Technical Program Specialist manages customer technical projects and serves as the primary point of contact for new quality and reliability programs
Job Summary
The Technical Program Specialist manages customer technical projects and serves as the primary point of contact for new quality and reliability programs.
Candidates must possess hands-on experience in wafer-level packaging processes such as wafer bumping, eWLB, or Fanout Packaging.
The role involves collaborating with sales and account management teams to drive market share and resolve complex technical issues.
Matching Summary
The Technical Program Specialist manages customer technical projects and serves as the primary point of contact for new quality and reliability programs.
Skills & Requirements
Must-have
Bachelor's Degree in engineering discipline
2-3 years assembly process experience
Wafer bumping or WLCSP packaging knowledge
DOE reliability requirements material selection
FMEA Failure Analysis quality statistical tools
Nice-to-have
SAP or ERP system familiarity
Excellent problem resolution skills
Effective communication in groups
Willingness to travel as needed
Self-driven initiative for programs
Key Requirements
Bachelor's Degree in any engineering discipline
2-3 years relevant working experience in back end semiconductor production