Packaging Module Equipment Development Engineer

Intel Corporation

Phoenix, Arizona, United States
Base: $120,860.00-170,630.00 usd; bonus/equity: st...
Onsite
Packaging module equipment development
First level/second level interconnect
Thermal solutions
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies

Job Summary

  • The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies.
  • The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing interconnect, thermal, and SMT/PCB technologies.
  • We offer a total compensation package that ranks among the best in the industry, consisting of competitive pay, stock bonuses, and benefit programs.

Matching Summary

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies.

Salary

Base: $120,860.00-170,630.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Packaging Module Equipment Development
  • First Level/Second Level Interconnect
  • Thermal solutions
  • SMT/PCB technologies
  • Semiconductor packaging platforms

Nice-to-have

  • Technical leadership
  • Strategic planning
  • Critical thinking
  • Adaptability in dynamic environment
  • Influencing skills

Key Requirements

  • PhD with one or more years experience
  • Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics
  • Minimum GPA of 3.5
  • At least one publication in peer-reviewed journal
  • Technology development experience
  • Semiconductor fabrication processes experience

Work Rights

Not specified

Tailored Resume

Cover Letter