Principal Engineer Advanced Package Technology Development
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Boise, Idaho, United States
Not specified; not specified; comprehensive benefi...
Onsite
High bandwidth memory expertise
2.5d and 3d integration strategies
Hybrid bonding process knowledge
Micron Semiconductor is seeking a Principal Engineer for its Advanced Package Technology Development team in Boise, Idaho. The role involves driving technical innovation in semiconductor advanced packaging, leading multi-disciplinary teams, and collaborating with internal and external partners to enhance technology solutions
Job Summary
This role involves leading multi-disciplinary teams to deliver high-value, differentiated technology solutions that align with company strategic goals.
The successful candidate will guide the development of packaging technology roadmaps while assessing competitive metrics through data intelligence.
Micron offers comprehensive benefits including healthcare, retirement savings plans, tuition reimbursement, and professional development training.
Matching Summary
Match Score: 85
Micron Semiconductor is seeking a Principal Engineer for its Advanced Package Technology Development team in Boise, Idaho. The role involves driving technical innovation in semiconductor advanced packaging, leading multi-disciplinary teams, and collaborating with internal and external partners to enhance technology solutions.
Salary
Not specified; Not specified; Comprehensive benefits including Healthcare, Retirement savings, Tuition Reimbursement
Skills & Requirements
Must-have
High Bandwidth Memory expertise
2.5D and 3D integration strategies
Hybrid bonding process knowledge
Wafer Level Packaging experience
DRAM manufacturing background
OSAT company experience
Nice-to-have
East Asian language proficiency
Patent invention portfolio
Published technical literature
Cost reduction initiative leadership
Quality improvement mentorship
Key Requirements
Over 5 years professional experience in semiconductor advanced packaging
BS, MS, or Ph.D. in Engineering or Material Science
Hands-on process module engineering in Wafer Level Packaging
Experience in DRAM manufacturing and OSAT companies