Sr Engineer, Advanced Packaging Design Enablement Engineering (apdee)

Micron Technology

Hyderabad, Telangana, India
Hybrid
High bandwidth memory packaging experience
Physical layout engineering expertise
Experience with tsv-based die design
Micron Technology is a leader in memory and storage solutions

Job Summary

  • Micron Technology is a leader in memory and storage solutions.
  • The role involves executing advanced packaging design strategies.
  • Collaboration with global design teams is essential for success.

Matching Summary

Micron Technology is a leader in memory and storage solutions.

Skills & Requirements

Must-have

  • High Bandwidth Memory packaging experience
  • Physical layout engineering expertise
  • Experience with TSV-based die design

Nice-to-have

  • Familiarity with chiplet architecture
  • Knowledge of HBM assembly processes
  • Experience with layout automation scripting

Key Requirements

  • Masters or PhD in Electrical Engineering
  • 5+ years of experience in die design
  • Direct experience with advanced packaging programs

Work Rights

Not specified

Tailored Resume

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