Process Engineer Section Manager

onsemi

Lapu-Lapu City, Philippines
Fol process engineering organization
Stable yield
High equipment/process capability
Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI)

Job Summary

  • Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
  • Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
  • Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

Matching Summary

Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).

Skills & Requirements

Must-have

  • FOL Process Engineering organization
  • stable yield
  • high equipment/process capability
  • adherence to customer and reliability requirements
  • timely closure of quality/EFAR/GMRB issues
  • continuous improvement
  • standardization
  • process governance
  • readiness for volume and package‑mix expansion
  • strategic process ownership
  • SPC governance
  • PFMEA/Control Plan
  • recipe management
  • process capability Ppk
  • documentation
  • engineering responses to yield losses
  • top defect contributors
  • customer complaints
  • reliability audit failures
  • GMRB cases
  • execution of Continuous Improvement Plan
  • productivity projects
  • proliferation activities
  • audit readiness
  • compliance to change control
  • cross‑functional alignment
  • technical talent development
  • process ownership strengthening
  • engineering workload balance
  • semiconductor assembly (Die Attach / Wire Bond)
  • high‑mix, high‑complexity FOL operations
  • yield improvement
  • DOE
  • equipment/materials qualification
  • technical mastery in FOL processes (DA, WB, Clip Attach, Plasma)
  • failure mechanisms
  • analytical skills (Minitab/Exensio/SPC)
  • problem‑solving (8D, DMAIC)
  • audit/customer‑facing communication
  • lead teams
  • manage cross‑functional escalations
  • sustain process governance
  • high‑volume/high‑complexity environments

Nice-to-have

  • disruptive innovations
  • automotive and industrial end-markets
  • vehicle electrification and safety
  • sustainable energy grids
  • industrial automation
  • 5G and cloud infrastructure
  • intelligent power and sensing technologies
  • high-performance innovators
  • positive recruitment experience

Key Requirements

  • Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field)
  • 8+ years in semiconductor assembly (Die Attach / Wire Bond)
  • proven leadership in high‑mix, high‑complexity FOL operations
  • Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification
  • Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms
  • Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication
  • Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments

Work Rights

Not specified

Tailored Resume

Cover Letter