Job Summary

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.

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Skills & Requirements

Key Requirements

• Bachelor’s or Master’s degree in a relevant field
• Involvement in R&D in assembly and packaging
• Knowledge in statistical design of experiments
• Problem-solving techniques

Work Rights