$141,910.00-269,100.00 usd; not specified; not spe...
Hybrid
Package substrate design rules
Technology and product concept involvement
Cross-disciplinary stakeholder collaboration
The Package Substrate Design Rule Owner (DRO) is responsible for definition, validation and deployment of design rules for package substrate design
Job Summary
The Package Substrate Design Rule Owner (DRO) is responsible for definition, validation and deployment of design rules for package substrate design.
The DRO collaborates with product design, substrate manufacturing and package assembly to identify and drive design rules that enable competitive product designs that meet cost and manufacturability requirements.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Matching Summary
The Package Substrate Design Rule Owner (DRO) is responsible for definition, validation and deployment of design rules for package substrate design.
Salary
$141,910.00-269,100.00 USD; Not specified; Not specified
Skills & Requirements
Must-have
Package substrate design rules
Technology and product concept involvement
Cross-disciplinary stakeholder collaboration
Semiconductor fabrication processes
Package substrate physical design
Nice-to-have
Advanced packaging architectures expertise
Strong analytical and problem-solving skills
Independent work and abstraction levels
Strong organization and time management
Good understanding of IC Packaging
Key Requirements
US Citizenship required
Ability to obtain TS/SCI Security Clearance with Polygraph
Bachelor's degree in STEM field
6+ years experience (Bachelor's)
2+ years in semiconductor fabrication
2+ years in package substrate design/manufacturing
Work Rights
Must have US citizenship and ability to obtain TS/SCI Security Clearance with Polygraph