Foveros Direct Pathfinding Integration

Intel

Hillsboro, Oregon, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Hybrid
Packaging engineering experience
Thermal mechanical electrical design concepts
Qualification testing and specification documentation
This role involves applying scientific principles to design and qualify packaging solutions for Intel's industry-leading semiconductor innovations

Job Summary

  • This role involves applying scientific principles to design and qualify packaging solutions for Intel's industry-leading semiconductor innovations.
  • The position requires managing the full packaging development process including prototypes, qualification testing, and coordination with manufacturing partners.
  • Employees will work within a worldwide factory network dedicated to delivering cutting-edge silicon process and packaging technology leadership.

Matching Summary

This role involves applying scientific principles to design and qualify packaging solutions for Intel's industry-leading semiconductor innovations.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Packaging engineering experience
  • Thermal mechanical electrical design concepts
  • Qualification testing and specification documentation

Nice-to-have

  • Advanced packaging technology development
  • Strategic supplier management experience
  • Cross-functional stakeholder engagement

Key Requirements

  • Bachelor's degree in engineering or related field with 6+ years experience
  • Master's degree in engineering or related field with 4+ years experience
  • PhD in engineering or related field with 4+ years experience

Work Rights

Not specified

Tailored Resume

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