ON Semiconductor is seeking a Staff Process Engineer specialized in wirebond processes to optimize and control thermosonic wire bonding in semiconductor manufacturing. The ideal candidate will have extensive experience in wirebonding, materials, and tooling to ensure high yields and quality
Job Summary
The role requires owning the thermosonic wire bond process to deliver robust interconnect quality and high yields in a fast-paced manufacturing environment.
Candidates must lead problem-solving efforts using 8 Discipline methodologies for critical losses like deformed bonds, heel cracks, and cratering.
The position involves managing equipment capabilities across K&S, ASM, and Shinkawa platforms while ensuring compliance with IATF/ISO standards.
Matching Summary
Match Score: 85
ON Semiconductor is seeking a Staff Process Engineer specialized in wirebond processes to optimize and control thermosonic wire bonding in semiconductor manufacturing. The ideal candidate will have extensive experience in wirebonding, materials, and tooling to ensure high yields and quality.
Skills & Requirements
Must-have
10+ years semiconductor manufacturing experience
5+ years thermosonic wire bonding expertise
K&S ASM Shinkawa UTC platform proficiency
SPC DOE PFMEA statistical troubleshooting skills
Root cause analysis using 8D DMAIC methods
Wire pull bond shear capability management
Nice-to-have
Experience with Cu wire advanced interconnects
Fine-pitch low-loop multi-tier bonding exposure
Customer complaint EFAR handling experience
GMRB documentation knowledge for die attach
Coaching technicians on bond optimization
Key Requirements
Bachelor's degree in Engineering (Industrial, Manufacturing, Electronics)
10+ years total semiconductor manufacturing experience
Minimum 5 years focused on wirebond thermosonic processes
Practical experience with Au/Al/Cu wires and diverse package families