Silicon Packaging Design Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, US
Base: $91,150.00-128,690.00 usd; bonus/equity: sto...
Valor, cadence apd, siemens xpedition, or cad software
Physical layout of substrate design
End-to-end mask and panel design
As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, Foundry Services (FS) is being established as a fully vertical, stand-alone foundry business

Job Summary

  • As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, Foundry Services (FS) is being established as a fully vertical, stand-alone foundry business.
  • Silicon packaging engineering responsibilities include driving end-to-end development for mask and panel design from concept through tape out for a given package to produce within the substrate factory.
  • We offer a total compensation package that ranks among the best in the industry, consisting of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Matching Summary

As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, Foundry Services (FS) is being established as a fully vertical, stand-alone foundry business.

Salary

Base: $91,150.00-128,690.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Valor, Cadence APD, Siemens Xpedition, or CAD software
  • Physical layout of substrate design
  • End-to-end mask and panel design
  • Substrate factory production

Nice-to-have

  • Creative problem-solving skills
  • Microelectronic package substrate technology
  • Python, VB, C, or other scripting languages

Key Requirements

  • Bachelor’s degree in electrical engineering or related field
  • 6+ months of relevant experience
  • Prior experience with physical layout aspects of substrate design/layout

Work Rights

Not specified

Tailored Resume

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