Ic Packaging Engineer

NVIDIA

Israel
2+ years in semiconductor packaging
Basic design skills in 2d and 3d applications
High awareness for quality and manufacturability
NVIDIA is transforming computing through innovation and technology

Job Summary

  • NVIDIA is transforming computing through innovation and technology.
  • The role involves leading the development of microelectronics packaging.
  • NVIDIA values diversity and offers competitive salaries and benefits.

Matching Summary

NVIDIA is transforming computing through innovation and technology.

Skills & Requirements

Must-have

  • 2+ years in semiconductor packaging
  • Basic design skills in 2D and 3D applications
  • High awareness for quality and manufacturability

Nice-to-have

  • Hands-on FEA mechanical simulation experience
  • Team and project management experience
  • Background in semiconductor manufacturing processes

Key Requirements

  • BSc in Mechanical/Material Engineering or equivalent
  • Experience in DFM and tooling design

Work Rights

Not specified

Tailored Resume

Cover Letter