Packaging Module Equipment Development Engineer

Intel

Phoenix, Arizona, United States
Base: $120,860.00-170,630.00 usd; bonus/equity: st...
Onsite
Phd in materials science or related field
Minimum gpa of 3.5
Peer-reviewed technical journal publication
The role involves developing advanced packaging technologies including interconnects and thermal solutions for Intel's future platforms

Job Summary

  • The role involves developing advanced packaging technologies including interconnects and thermal solutions for Intel's future platforms.
  • Candidates must possess a PhD with at least one peer-reviewed publication and a minimum GPA of 3.5 to be considered.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

The role involves developing advanced packaging technologies including interconnects and thermal solutions for Intel's future platforms.

Salary

Base: $120,860.00-170,630.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation provided

Skills & Requirements

Must-have

  • PhD in Materials Science or related field
  • Minimum GPA of 3.5
  • Peer-reviewed technical journal publication
  • First Level/Second Level Interconnect development
  • Thermal solutions (TIM1) expertise
  • SMT/PCB technology knowledge

Nice-to-have

  • Statistical Process Control (SPC) experience
  • Design of Experiments (DOE) familiarity
  • Leadership in matrixed organizations
  • Tolerance for ambiguity and adaptability
  • Strong communication and influencing skills

Key Requirements

  • PhD required prior to start date
  • One or more years of relevant experience
  • US work authorization not explicitly specified

Work Rights

Not specified

Tailored Resume

Cover Letter