Advanced Packaging Substrate Supplier Enablement Lead

Intel Corporation

Phoenix, Arizona, United States
Base: $140,830.00-269,950.00 usd; bonus/equity: st...
Advanced packaging substrate experience
Supplier development and readiness
Factory ramp execution management
This role leads global substrate supplier development to support Intel's high performance and AI centric product roadmap

Job Summary

  • This role leads global substrate supplier development to support Intel's high performance and AI centric product roadmap.
  • The position requires driving the qualification of new capacity including tool installs, process capability, and factory maturity.
  • Intel offers a competitive total compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

This role leads global substrate supplier development to support Intel's high performance and AI centric product roadmap.

Salary

Base: $140,830.00-269,950.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Advanced packaging substrate experience
  • Supplier development and readiness
  • Factory ramp execution management
  • Process capability and tool installs
  • Strategic technology roadmap alignment

Nice-to-have

  • Thriving in high-ambiguity environments
  • Mentoring and developing technical talent
  • Structured problem solving skills
  • Driving yield improvements
  • Global team alignment leadership

Key Requirements

  • Bachelor's degree in engineering or related field with 6+ years experience
  • Master's degree in engineering or related field with 4+ years experience
  • PhD degree in engineering or related field with 2+ years experience
  • Experience in advanced packaging, substrates, or semiconductor manufacturing

Work Rights

Not specified

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