Module Development Engineering Manager

Intel Retiree Medical Plan Trust

Hillsboro, Oregon, United States
Base: $155,520.00-255,200.00 usd; bonus/equity: st...
Manage engineering team leadership
Define technology roadmap alignment
Optimize power performance and cost
Lead a group of talented engineers to develop and transfer advanced technology solutions for next-generation wafer processing and assembly

Job Summary

  • Lead a group of talented engineers to develop and transfer advanced technology solutions for next-generation wafer processing and assembly.
  • Ensure successful implementation of cutting-edge technologies that enable Intel's leadership in power performance and structural efficiency.
  • Receive competitive pay, stock bonuses, and comprehensive benefit programs including health, retirement, and vacation.

Matching Summary

Lead a group of talented engineers to develop and transfer advanced technology solutions for next-generation wafer processing and assembly.

Salary

Base: $155,520.00-255,200.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation provided

Skills & Requirements

Must-have

  • Manage engineering team leadership
  • Define technology roadmap alignment
  • Optimize power performance and cost
  • Drive cross-functional collaboration
  • Partner with supplier executive management

Nice-to-have

  • Coach and mentor engineering talent
  • Foster inclusive work environment
  • Distill conflicting data into solutions
  • Nurture unique industry research ideas

Key Requirements

  • Bachelor's degree plus 6+ years experience
  • Master's degree plus 4+ years experience
  • PhD plus 2+ years experience
  • Expertise in optical characterization and scripting
  • Leadership in complex engineering environments

Work Rights

Not specified

Tailored Resume

Cover Letter