Sr. Engineering Manager, Advanced Packaging Technology And Manufacturing Product Engineering

Intel

Phoenix, Arizona, US
Base: $256,050.00-361,480.00 usd; bonus/equity: st...
Hybrid
Product optimization for dfx
Yield and quality management
Testability and manufacturability
Establish, develop, and scale the end-to-end product engineering team that optimizes advanced packaging products for design, testability, yield, and quality

Job Summary

  • Establish, develop, and scale the end-to-end product engineering team that optimizes advanced packaging products for design, testability, yield, and quality.
  • Drive optimized solutions across a broad spectrum of advanced packaging technologies while meeting the highest quality standards for internal and external customers.
  • Lead organization and leadership development to grow technical capability and business acumen to enable the capability to deliver to product commitments.

Matching Summary

Establish, develop, and scale the end-to-end product engineering team that optimizes advanced packaging products for design, testability, yield, and quality.

Salary

Base: $256,050.00-361,480.00 USD; Bonus/Equity: Stock bonuses; Benefits: Health, retirement, and vacation

Skills & Requirements

Must-have

  • Product optimization for DFx
  • Yield and quality management
  • Testability and manufacturability
  • Cross-functional team leadership
  • Data analysis and root-cause identification

Nice-to-have

  • Develop organizational structure and roadmap
  • Influence test vehicle designs
  • Establish standardized guidelines
  • Develop business process for NPI execution
  • Lead organization and leadership development

Key Requirements

  • 12+ years of relevant experience with a Bachelor's degree
  • 8+ years with a Master's degree
  • 6+ years with a PhD
  • Bachelor's or Master's degree in Electrical engineering or related field

Work Rights

Not specified

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