Senior Reliability Engineer - Lpu Packaging

Nvidia Corporation

CA, United States
Base: 168,000 usd - 310,500 usd; bonus/equity: equ...
On-site
Package-level reliability specification
Define qualification requirements and pass/fail criteria
Materials and stackup selection
NVIDIA is seeking a Senior Reliability Engineer to join their LPU packaging team, focusing on package-level reliability for advanced products. The role requires extensive experience in IC packaging and board-level reliability, along with a strong background in relevant engineering fields

Job Summary

  • Own the package‑level reliability spec for assigned products, defining qualification requirements and pass/fail criteria for device/package‑level reliability.
  • Leads materials and stackup selection and DFR trade‑offs, evaluating thermo‑mechanical and SI/PI impact of those choices.
  • Analyzes qual and stress data and converts it to design / process/ material changes for the next revision, understanding how component FIT rolls up from component level to system level.

Matching Summary

Match Score: 85

NVIDIA is seeking a Senior Reliability Engineer to join their LPU packaging team, focusing on package-level reliability for advanced products. The role requires extensive experience in IC packaging and board-level reliability, along with a strong background in relevant engineering fields.

Salary

Base: 168,000 USD - 310,500 USD; Bonus/Equity: Equity; Benefits: Generous benefits package

Skills & Requirements

Must-have

  • Package-level reliability specification
  • Define qualification requirements and pass/fail criteria
  • Materials and stackup selection
  • Evaluate thermo-mechanical and SI/PI impact
  • Analyze qual and stress data
  • Understand component FIT roll-up

Nice-to-have

  • Lead cross-functional efforts
  • Data center or cloud hardware experience
  • Present trade-offs and risks clearly

Key Requirements

  • MS/PhD or equivalent experience
  • 8+ years of relevant experience
  • Experience with BGA/FCBGA, 2.5D/3D integration, HBM
  • Background with JEDEC device/package reliability standards
  • Knowledge in system-level stress or SLT
  • Solid understanding of FIT, MTTF/MTBF, AFR, and RAS concepts

Work Rights

Not specified

Tailored Resume

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