Defect Characterization Low Yield Analysis Engineering Technician

Intel Retiree Medical Plan Trust

Phoenix, Arizona, USA
$70,670.00-116,640.00 usd py
Sem, edx, x-ray, ion mill operation
Failure analysis and root cause determination
Technical reporting and presentations
Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement

Job Summary

  • Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.
  • Conducts physical and technical failure analysis to identify defects causing inline yield loss and determines root cause using advanced characterization techniques.
  • Documents and communicates findings through technical reports and presentations to engineers, operators, and management, and provides recommendations for process, material, or equipment improvements.

Matching Summary

Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.

Salary

$70,670.00-116,640.00 USD

Skills & Requirements

Must-have

  • SEM, EDX, X-ray, ion mill operation
  • Failure analysis and root cause determination
  • Technical reporting and presentations
  • Backend shift operations support

Nice-to-have

  • Continuous learning and manufacturing excellence
  • Collaboration with cross-functional teams
  • Passion for continuous improvement

Key Requirements

  • High School diploma with 10+ years of experience
  • AA/AS degree with 6+ years of experience
  • Bachelor's degree with 4+ years of experience
  • US citizen or permanent resident

Work Rights

US citizenship or Green Card

Tailored Resume

Cover Letter