Npi Engineering Intern -  advanced Package Technology

ASM

Hsinchu, Taiwan
Pyid internship; not specified; not specified
Hybrid
Phd student in electrical engineering or materials science
Strong background in semiconductor package process
Experience with 3dic or 2.5d integration research
ASM is seeking a motivated Engineering Intern for their advanced package technology team in Hsinchu, Taiwan. The internship focuses on research and evaluation of semiconductor packaging technologies, offering students a chance to engage with cutting-edge industry projects and develop essential skills

Job Summary

  • This paid internship offers hands-on experience evaluating early-stage, next-generation semiconductor package technology.
  • The intern will conduct a structured review of academic journals, patents, and industry sources to map the current package development landscape.
  • Participants will gain exposure to how advanced technology concepts are assessed prior to major R&D investment while working alongside senior engineers.

Matching Summary

Match Score: 85

ASM is seeking a motivated Engineering Intern for their advanced package technology team in Hsinchu, Taiwan. The internship focuses on research and evaluation of semiconductor packaging technologies, offering students a chance to engage with cutting-edge industry projects and develop essential skills.

Salary

Paid internship; Not specified; Not specified

Skills & Requirements

Must-have

  • PhD student in Electrical Engineering or Materials Science
  • Strong background in semiconductor package process
  • Experience with 3DIC or 2.5D integration research
  • Ability to conduct systematic literature reviews
  • Skills in synthesizing fragmented technical information

Nice-to-have

  • Interest in advanced package beyond state of the art
  • Familiarity with patent analysis and industry signals
  • Experience preparing technical documentation and presentations
  • Collaborative mindset in a diverse team environment

Key Requirements

  • Currently pursuing a PhD degree
  • Background in semiconductor package process
  • Knowledge of 3DIC or 2.5D integration

Work Rights

Not specified

Tailored Resume

Cover Letter