Rf/electrical, thermal, mechanical, reliability, and cost optimization
Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities
Job Summary
Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities.
As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.
You'll be at the forefront of wireless technology innovation, directly impacting next-generation WiFi, Bluetooth, and mmWave solutions that connect the world.
Matching Summary
Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities.