Cvd Process Engineer - Wafer Bonding

Samsung Electronics

Austin, TX, United States
Base: $70,480 - $179,090; bonus/equity: not specif...
Hybrid
Wafer bonding experience
Process troubleshooting skills
Equipment operation expertise
Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding

Job Summary

  • Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding.
  • The role involves designing and executing process experiments and troubleshooting process issues.
  • A comprehensive benefits package is offered, including medical, dental, and vision insurance.

Matching Summary

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding.

Salary

Base: $70,480 - $179,090; Bonus/Equity: Not specified; Benefits: Comprehensive package including medical, dental, and vision insurance

Skills & Requirements

Must-have

  • Wafer bonding experience
  • Process troubleshooting skills
  • Equipment operation expertise

Nice-to-have

  • Programming skills in VBA or Python
  • Team-oriented culture
  • Experience with semiconductor equipment

Key Requirements

  • Bachelor’s degree in Engineering
  • Minimum of 5 years of engineering experience
  • Minimum of 3 years in wafer bonding

Work Rights

Not specified

Tailored Resume

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