Foundry Services Advanced Packaging Account Technical Solutions Engineer

Inteelabs

Phoenix, Arizona, US
Base: $220,320.00-311,040.00 usd; bonus/equity: st...
Semiconductor packaging expertise
Customer-facing skills
Technical consultation
Intel Foundry is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers

Job Summary

  • Intel Foundry is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers.
  • This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Intel Foundry is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers.

Salary

Base: $220,320.00-311,040.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Semiconductor Packaging expertise
  • Customer-facing skills
  • Technical consultation
  • Cross-functional collaboration

Nice-to-have

  • Voice of the Customer advocacy
  • Influence product roadmaps
  • Sustainable supply chain focus

Key Requirements

  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing
  • Bachelors or Masters Degree in Engineering or related field

Work Rights

Not specified

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