Thermosonic and ultrasonic wire bonding techniques
Asm wire bonders programming and operation
You will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production
Job Summary
You will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production.
You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
Nexperia is committed to diversity and inclusion, providing an inclusive recruitment process and supporting employee resource groups such as the Pride Network Group and women's groups.
Matching Summary
You will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production.
Skills & Requirements
Must-have
Wire bonding equipment setup and optimization
Thermosonic and ultrasonic wire bonding techniques
ASM wire bonders programming and operation
Process data analysis and troubleshooting
Statistical tools usage JMP and Minitab
Nice-to-have
Mentoring junior engineers
Cross-functional team collaboration
Knowledge of semiconductor quality control
Experience with KNS wire bonders
Continuous improvement and innovation mindset
Key Requirements
Bachelor’s degree in Electrical/Electronic, Mechanical Engineering or Materials Science
Minimum 5 years experience in wire bonding and semiconductor process engineering
Strong understanding of Gold and Copper wire bonding techniques