Advanced Package And 3dic Solutions Director

Cadence

Base: $157,500 to $292,500; bonus/equity: eligible...
Allegro package designer (apd) expertise
2.5d, 3dic and stacked die technologies
Virtuoso-ready apd package file creation
This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions

Job Summary

  • This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions.
  • The candidate is expected to be an expert in Allegro Package Designer with extensive experience in routing laminates, RDL designs, and implementing bondwires and bumps.
  • Benefits include paid vacation, a 401(k) plan with employer match, employee stock purchase plan, and various medical, dental, and vision options.

Matching Summary

This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions.

Salary

Base: $157,500 to $292,500; Bonus/Equity: Eligible for incentive compensation; Benefits: Paid vacation, 401(k), stock purchase, medical/dental/vision

Skills & Requirements

Must-have

  • Allegro Package Designer (APD) expertise
  • 2.5D, 3DIC and stacked die technologies
  • Virtuoso-ready APD package file creation
  • GDS, Gerber, IPC and DXF format handling
  • Bachelor's degree in Electrical Engineering

Nice-to-have

  • Allegro SKILL scripting and automation
  • RF and standard based routing experience
  • Strong customer-facing communication skills
  • Continuous learning and professional growth
  • Chip level CMOS design concepts understanding

Key Requirements

  • Minimum 20 years experience with package design
  • 10 years experience as an APD expert
  • Masters degree preferred in Electrical or Electronics Engineering

Work Rights

Not specified

Tailored Resume

Cover Letter