Japan-based Applications Engineer – 3d Tomography

ZEISS Group

Japan
Not specified; not specified; medical vision denta...
Fluency in japanese required
Experience with sem imaging mechanisms
Hands-on development of applications
ZEISS is seeking an innovative engineer to develop advanced metrology solutions for semiconductor manufacturing using FIB-SEM technology

Job Summary

  • ZEISS is seeking an innovative engineer to develop advanced metrology solutions for semiconductor manufacturing using FIB-SEM technology.
  • The role involves a three-year assignment based in Japan at customer sites followed by a long-term position in the United States.
  • Employees enjoy comprehensive benefits including medical, vision, dental, 401k matching, and employee assistance programs.

Matching Summary

ZEISS is seeking an innovative engineer to develop advanced metrology solutions for semiconductor manufacturing using FIB-SEM technology.

Salary

Not specified; Not specified; Medical Vision Dental 401k Matching Employee Assistance Programs Vacation and sick pay

Skills & Requirements

Must-have

  • Fluency in Japanese required
  • Experience with SEM imaging mechanisms
  • Hands-on development of applications
  • Operating FIB-SEM systems in clean rooms

Nice-to-have

  • Experience with FIB-SEM sample preparation
  • Knowledge of Python for data analytics
  • Strong desire to learn and positive thinking
  • Excellent communication skills and teamwork

Key Requirements

  • Bachelor or Master Degree in Engineering, Material Science, Physics or Chemistry
  • Fluency in Japanese written and verbal
  • Experience with Design of Experiments (DOE) and Statistical Process Control (SPC)

Work Rights

Not specified

Tailored Resume

Cover Letter