Base: $159,700 - $230,000 usd; bonus/equity: not s...
Osat supplier management
Npi readiness and execution
Yield optimization and root cause analysis
Drive outsourced assembly and test engineering activities across Altera’s global supplier network, leading NPI readiness, yield optimization, cost improvements, and qualification activity
Job Summary
Drive outsourced assembly and test engineering activities across Altera’s global supplier network, leading NPI readiness, yield optimization, cost improvements, and qualification activity.
Optimize packaging and test architectures for performance, cost, and reliability, including flip-chip BGA, high-pin-count packages, and wafer-level solutions.
Monitor and improve backend yield performance using data-driven analysis, identify systemic issues, and lead root cause/corrective actions in collaboration with cross-functional teams.
Matching Summary
Drive outsourced assembly and test engineering activities across Altera’s global supplier network, leading NPI readiness, yield optimization, cost improvements, and qualification activity.
Salary
Base: $159,700 - $230,000 USD; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
OSAT supplier management
NPI readiness and execution
Yield optimization and root cause analysis
Packaging and test architecture optimization
Semiconductor backend manufacturing flows
Nice-to-have
Automated manufacturing systems
Supply chain risk mitigation
Automotive or high-reliability product qualifications
Key Requirements
Bachelor's degree in EE, Materials Science, ME, or related field
10+ years semiconductor assembly, packaging, or test engineering experience