Thermal Mechanical Modeling Engineer

The University of Texas at Austin

AUSTIN, TX, US
Tie pyys industry competitive salaries
**
Multiphysics simulations
Advanced packaging
Heterogeneous integration
** The University of Texas at Austin is seeking a Thermal Mechanical Modeling Engineer to lead thermal and mechanical simulations for advanced semiconductor packaging. The ideal candidate will have experience in multiphysics simulations and collaboration with EDA vendors, focusing on 2.5D and 3D heterogeneous integration. **

Job Summary

  • The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on developing and executing a 3D Heterogenous Integration manufacturing technology roadmap.
  • Responsibilities include owning and executing hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
  • The University of Texas at Austin provides competitive health benefits, a defined benefit retirement plan with employer matching, and other comprehensive employee benefits.

Matching Summary

Match Score: 75

** The University of Texas at Austin is seeking a Thermal Mechanical Modeling Engineer to lead thermal and mechanical simulations for advanced semiconductor packaging. The ideal candidate will have experience in multiphysics simulations and collaboration with EDA vendors, focusing on 2.5D and 3D heterogeneous integration. **

Salary

TIE Pays Industry Competitive Salaries

Skills & Requirements

Must-have

  • multiphysics simulations
  • advanced packaging
  • heterogeneous integration
  • EDA/EM/multiphysics tools
  • scripting/automation skills

Nice-to-have

  • technical strategy guidance
  • mentoring junior engineers
  • industry standards familiarity

Key Requirements

  • BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline
  • 3+ years of direct, hands-on experience in multiphysics simulations
  • MS or PhD in Electrical Engineering, Applied Physics, or related discipline (for Senior Engineer)
  • 5+ years of direct, hands-on experience in multiphysics simulations (for Senior Engineer)
  • Must be eligible to work in the United States on a full-time basis without sponsorship

Work Rights

Not specified

Tailored Resume

Cover Letter