Senior Or Principal Technical Program Manager

The University of Texas at Austin

Austin, TX, US
Industry-competitive salaries; benefits: competiti...
Hybrid
8+ years semiconductor packaging experience
Advanced packaging technologies expertise
Cross-disciplinary program execution
The Texas Institute for Electronics is a transformative, well-funded semiconductor foundry venture backed by $1.4 billion in combined funding from DARPA and Texas state initiatives

Job Summary

  • The Texas Institute for Electronics is a transformative, well-funded semiconductor foundry venture backed by $1.4 billion in combined funding from DARPA and Texas state initiatives.
  • This role leads planning, execution, and delivery of cross-disciplinary programs supporting the institute's advanced microsystems roadmap while serving as a central liaison between technical teams and external stakeholders.
  • The position offers competitive health benefits with employee premiums covered at 100%, generous paid time off, and access to UT Austin's libraries and museums.

Matching Summary

The Texas Institute for Electronics is a transformative, well-funded semiconductor foundry venture backed by $1.4 billion in combined funding from DARPA and Texas state initiatives.

Salary

Industry-Competitive Salaries; Benefits: Competitive health (100% employee premium), TRS retirement matching 8.25%; Not specified

Skills & Requirements

Must-have

  • 8+ years semiconductor packaging experience
  • Advanced packaging technologies expertise
  • Cross-disciplinary program execution
  • Stakeholder management across R&D and manufacturing
  • EDA flows and fabrication process knowledge

Nice-to-have

  • Startup DNA and agility in ambiguity
  • Experience with DoD or national lab partners
  • Strong communication simplifying complex topics
  • Hands-on execution without management layers
  • Prior foundry or packaging house background

Key Requirements

  • BS in Electrical Engineering or related discipline
  • 8+ years industry experience for Senior level
  • 10+ years industry experience for Principal level
  • Proven expertise in 2.5D interposers and TSVs
  • Working knowledge of PDK/ADK creation and EDA flows

Work Rights

Not specified

Tailored Resume

Cover Letter