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NVIDIA is seeking an experienced IC Packaging Engineer to join their team in Israel, focusing on the development of advanced microelectronics packaging for their products. The role requires collaboration with design and program teams, emphasizing innovation and quality in semiconductor packaging solutions.
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Job Summary
Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
NVIDIA, an equal-opportunity employer that values diversity and inclusion, offers highly competitive salaries and a comprehensive benefits package.
Matching Summary
Match Score: 75
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NVIDIA is seeking an experienced IC Packaging Engineer to join their team in Israel, focusing on the development of advanced microelectronics packaging for their products. The role requires collaboration with design and program teams, emphasizing innovation and quality in semiconductor packaging solutions.
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Skills & Requirements
Must-have
microelectronics packaging development
evaluate reliability and performance
review manufacturability readiness
work with world leading vendors
support production excursions
monitor substrate and assembly KPIs
lead process changes reviews
Nice-to-have
dynamic and challenging environment
continuous learning and improvement
curious and creative problem solver
well organized and multi-tasker
Key Requirements
BSc or equivalent Mechanical/Material Engineering degree