Senior Program Manager – Advanced Packaging & Technology Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore
Not specified; not specified; not specified
Not specified (assumed to be hybrid based on industry trends).
8+ years semiconductor packaging experience
Lead cross-functional program execution
Advanced packaging flows knowledge
The Senior Program Manager position at Micron Semiconductor Asia Operations in Singapore focuses on leading strategic initiatives in advanced packaging and technology development. The role emphasizes program management, cross-functional collaboration, and operational excellence to drive innovation and yield maturity in semiconductor packaging

Job Summary

  • The role leads strategic initiatives across the Advanced Packaging & Technology Development organization to accelerate yield maturity and future innovations.
  • Candidates must define program objectives, oversee full lifecycle execution, and ensure alignment with mission goals through standardized governance frameworks.
  • Success requires a proven track record of managing complex, cross-functional programs in high-tech semiconductor environments with strong communication skills.

Matching Summary

Match Score: 85

The Senior Program Manager position at Micron Semiconductor Asia Operations in Singapore focuses on leading strategic initiatives in advanced packaging and technology development. The role emphasizes program management, cross-functional collaboration, and operational excellence to drive innovation and yield maturity in semiconductor packaging.

Salary

Not specified; Not specified; Not specified

Skills & Requirements

Must-have

  • 8+ years semiconductor packaging experience
  • Lead cross-functional program execution
  • Advanced packaging flows knowledge
  • CapEx and OpEx planning expertise
  • Yield maturity and technology transfer

Nice-to-have

  • IIoT hardware deployment experience
  • Simulation modeling proficiency
  • Mentoring project managers skills
  • Analytics integration in workflows
  • Stakeholder management excellence

Key Requirements

  • Bachelor's or Master's degree in Engineering or Materials Science
  • 8+ years experience in semiconductor packaging or process integration
  • Solid understanding of hybrid bonding and CoWoS technologies

Work Rights

Not specified

Tailored Resume

Cover Letter